Public Title Laser Assisted Micro Machining Method and Device Division Lead Inventor Shin, Yung Public Description In order to create micro- and meso- scale parts out of very hard materials such as ceramics, slow and costly methods have been traditionally implemented. These methods require micro EDM, ultrasonic machining, or short pulse laser machining, all of which include the potential for a recast layer or subsurface damage. Researchers at Purdue University have invented a method for laser assisted micro machining which prevents any subsurface damage and can be used on both conductive and non-conductive materials. The invention allows very hard materials to be cut at relatively high speeds compared to most existing methods with attainable feature sizes from 25 microns to 1000 microns (1mm). Patent Status Public References Key Words Manager Eric Lynch Email eslynch@prf.org Telephone 765-588-3477 Fax 765-463-3486   Back to List